What We Do
RTD3171C(384×28817μm ) thermal imaging sensor

Performances

· Array Format:384×288

· Pixel pitch:17μm    

· NETD:≤60 or 40mK(@f/1.0, 300K, 50Hz    )

· Operability:>99.9%

· Frame rate: 50Hz/60Hz

· SiTF: 5~20mV/K(adjustble)

· Power consumption(at 25℃, excluding TEC): <150mW     

· Operating temperature range:-40℃~+85℃

· Spectral band:8~14μm    

· Weight:<5g

· Overall size:22mm×22mm×3.4mm

Features

· Vanadium oxide microbolometer technology

· TEC-Less Operation Compatible

· on-chip 8 bit DDAC

· Typical thermal time constant: 10ms(6ms optional)

· Ajustable integration time

· Ajustable integration capacitor

· Output swing: 1.0V~3.4V

· Power supply: Analog 3.6V, Digital 1.8V

· Rolling shutter readout mode

· 32-lead ceramic vacuum package